VELCRO POLISHING FOAM FINE Ø 150/180MMRupes

VELCRO POLISHING FOAM FINE Ø 150/180MM

RUPES’ expanded resin foam polishing pads are specially designed for the random orbital polishing system. They produce excellent results with substantial time saving and reduced compound consumption. BigFoot’s random orbital movement creates high mechanical stresses on the foam polishing pads, generating an increase in internal temperature. The innovative “open cell” structure of the BigFoot foam polishing pads prevents the build-up of heat generated during the polishing process. In addition, this particular structure guarantees maximum efficiency in the polishing process with minimum downward vertical pressure from the operator. The center hole creates superior ventilation and heat dispersion through special channels in the backing pad. The innovative design of the truncated cone shape optimizes the performance of the large diameter orbit, and at the same time protects against accidental contact between the backing pad and the work surface.

FINE
This most versatile of BigFoot pads adapts to the type of compound used. Its fine cell structure has a medium/hard consistency. Produced from superior grade resins, the fine pad heightens the “gloss level” of the compounds while offering excellent speed of correction.

Following are recommended compound/medium foam pad combinations:

- Quarz abrasive compound for an excellent finish in one-step applications;
- Keramik abrasive compound for excellent results on difficult surfaces/this combination will easily remove light swirls and holograms;
- Diamond abrasive compound to obtain extremely high levels of gloss on hard surfaces.

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